Advances in Bioelectronic Devices and Nonfibrotic Neural Interfaces

Advances in Bioelectronic Devices and Nonfibrotic Neural Interfaces

Advances in electronics over the last decade have enabled new treatments for conditions that were previously 
difficult to manage due to drug resistance. Bioelectronic devices are becoming a safer and more effective option with 
advanced technological development. These systems are generally composed of an implantable device that can 
exhibit a neuromodulatory response using electrical signals to assist in disease prevention or treatment [1]. Their 
composition can vary, but consists of electrodes, a signal generator, a data processor, and a storage unit [1].
Bioelectronic devices can be used throughout the body, with the first system being developed in the 1950s as a 
pacemaker [2]. Some devices currently on the market can treat conditions such as epilepsy, blindness, chronic pain, 
sleep apnea, and atrial fibrillation [2].

A major barrier, however, stems from the body's reaction to implantable systems, causing an inflammatory response 
in the tissue. The foreign body reaction can lead to a dense collagen-rich fibrous connective tissue capsule that 
surrounds the area, causing significant pain and infection, which impair the device's ability to operate effectively [3].
This response can lead to fibrosis, in which dense, scar-like tissue forms around the implant and compromises both 
organ function and device performance. Therefore, biocompatibility between the system and the body is imperative 
for not only the health of the patient, but also the effectiveness of the intervention. This can be achieved through 
proper material selection, surface roughness, toughness, proper operating conditions that are like the body, and many 
other factors that require in-depth research to ensure successful implementation.

A recent study from MIT demonstrated an adhesive nonfibrotic bioelectronics (ANB) system that inhibits immune 
cell infiltration at the device–tissue interface, thereby preventing fibrous capsule formation [4]. The device 
specifically aims to change how implantable bioelectronics attach to peripheral nerves, as products currently on the 
market rely on sutures, ties, or mechanical compression of the nerve to stay in place [4]. However, their new system 
uses a hydrogel that chemically bonds directly to the nerve surface, forming a tight interface that significantly reduces 
immune cell infiltration, thus not allowing new fibrous tissue to form. The device was tested in rats, and there was
no fibrous capsule formation over the course of 12 weeks. This new device is different from those currently on the 
market that try to reduce tissue formation, as the design of this new ANB will prevent fibrotic connective tissue 
formation at the interface.
Innovations such as adhesive nonfibrotic bioelectronic interfaces represent a significant advancement in implantable 
device technology and highlight the growing potential of bioelectronics to improve long-term patient outcomes.


Written by Jennifer Joanna-Joan Villeneuve, 

References
Images from Figure 2 of Adhesive nonfibrotic bioelectronic interfaces on diverse peripheral nerves for long-term 
functional neuromodulation paper published in ScienceAdvances [4]
[1] “Bioelectronics for treating and monitoring disease,” Vibrant Science & Technology - EMD Group, 
https://www.emdgroup.com/en/research/science-space/envisioning-tomorrow/precisionmedicine/bioelectronics.html (accessed Dec. 12, 2025). 
[2] R. A. of Engineering, “Bioelectronic devices to treat neurological disorders,” Ingenia, 
https://www.ingenia.org.uk/articles/bioelectronic-devices-to-treat-neurological-disorders/ (accessed Dec. 11, 
2025). 
[3] J. M. Anderson, A. Rodriguez, and D. T. Chang, “Foreign body reaction to biomaterials,” Seminars in 
Immunology, vol. 20, no. 2, pp. 86–100, Apr. 2008. doi:10.1016/j.smim.2007.11.004 
[4] H. Moon et al., “Adhesive nonfibrotic bioelectronic interfaces on diverse peripheral nerves for long-term 
functional neuromodulation,” Science Advances, vol. 11, no. 45, Nov. 2025. doi:10.1126/sciadv.adz3668 

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